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TSMC · N2 RampASML · High-NA EUVNvidia · GB300 DemandSK Hynix · HBM4 SamplingCarl Zeiss SMT · Lens Block Lead TimesTRUMPF · EUV Laser CapacityShin-Etsu Chemical · Photoresist SupplyAjinomoto Fine-Techno · ABF AllocationSibelco · Spruce Pine QuartzIntel Foundry · 18A YieldApplied Materials · ALD BacklogEntegris · Contamination FiltersGlobalWafers · SOI Substrate SupplyLam Research · Plasma Etch OrdersHanmi Semiconductor · TC Bonder DemandTSMC · N2 RampASML · High-NA EUVNvidia · GB300 DemandSK Hynix · HBM4 SamplingCarl Zeiss SMT · Lens Block Lead TimesTRUMPF · EUV Laser CapacityShin-Etsu Chemical · Photoresist SupplyAjinomoto Fine-Techno · ABF AllocationSibelco · Spruce Pine QuartzIntel Foundry · 18A YieldApplied Materials · ALD BacklogEntegris · Contamination FiltersGlobalWafers · SOI Substrate SupplyLam Research · Plasma Etch OrdersHanmi Semiconductor · TC Bonder Demand
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MEMORYJun 5, 2026

HBM4 Shortage Set to Deepen: SK Hynix and Samsung Warn Supply Gap Persists into 2027

SK Hynix posted a record Q1 2026 operating margin of 72% — surpassing Nvidia's 65% — as its entire HBM capacity sold out months in advance. Samsung's memory chief confirmed shortages across DRAM products will continue through at least 2027, with customers signing multi-year contracts to secure allocation. The pivot to HBM is now consuming 23% of global DRAM wafer output.

8 min read→
FOUNDRYMay 28, 2026

TSMC's 2nm Ramp: CoWoS Yields Hit 98%, Five New Fabs Breaking Ground Simultaneously

At its 2026 Technology Symposium, TSMC disclosed that its 5.5-reticle CoWoS advanced packaging — the largest in the industry — has exceeded 98% yield in volume production. The company is launching five new fabrication plants in 2026 and projects 70% compound annual growth in 2nm capacity through 2028. All three 2nm fabs carry lead times of 78–104 weeks, fully booked.

11 min read→
GEOPOLITICSApr 28, 2026

The MATCH Act: Washington Moves to Ban DUV Lithography Exports to China

US lawmakers introduced the Multilateral Alignment of Technology Controls on Hardware (MATCH) Act, targeting ASML's DUV immersion systems — the last class of lithography equipment still legally flowing to Chinese fabs. The bill would also ban servicing of already-installed equipment in China, threatening a portion of ASML's high-margin service revenue. China accounts for roughly 20% of ASML's projected 2026 sales.

9 min read→
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