Supply Chain Explorer

Integrated Device Manufacturers (IDMs) design and make their own chips. Pure-play foundries build chips for others. OSATs handle advanced packaging, dicing, and testing of finished dies.

These companies build the physical, room-sized machines that populate cleanrooms: tools for lithography, thin-film deposition, chemical mechanical planarization, plasma etching, and diagnostic wafer inspection.

These engineering firms build the vital organs inside Level 3 machines: lasers, optical blocks, vacuum lines, gas delivery systems, and precision robotic units. Without these sub-assemblies, lithography and etching tools cannot operate.

These companies manufacture the raw mechanical components, specialized structural glass, positioning units, and electronics required by Level 4 subsystem creators — including mirror substrates, piezoelectric stages, optical encoders, and specialty elastomer seals.

These chemical and material firms supply the consumable assets that feed Level 2 fabs: raw silicon wafers, light-sensitive photoresists, polishing slurries, advanced packaging substrates, and specialty process gases.

The absolute bedrock tier. These entities handle raw mining of earth minerals, chemical cracking, and elementary processing that feed the Level 6 chemical formulation companies. Without these, no silicon wafer can be grown.